Cuivre ezali na résistance ya corrosion ya malamu mingi na ba environnements ya sec, kasi ezali na likoki ya kosala patine na likolo{0}}Humidité to soufre-ezali na ba environnements ya gaz, oyo esali que résistance ya contact emata. Likoló ya aluminium ezali na likoki ya kosala filme ya oxyde dense, oyo ekoki na esika na yango kopekisa ete epɔla lisusu. Kasi, résistance ya film ya oxyde (pene na 10⁻⁻⁶ω·cm2) ezali likolo mingi koleka oyo ya substrat ya cuivre (10⁻⁻⁶Ω·cm2), mpe esengeli kobongisa yango na nzela ya placage ya étain, placage ya nickel to traitement ya oxydation anodic.
In terms of the influence of temperature on electrical conductivity, the temperature coefficient of resistance of copper (0.0043/℃) is lower than that of aluminum (0.0041/℃), but the coefficient of thermal expansion of aluminum (23.6×10⁻⁶/℃) is 1.4 times that of copper (16.5×10⁻⁶/℃). Na ba scénarios oyo ezali na ba fluctuations ya température ya monene, expansion thermique mpe contraction ya ba barres ya aluminium ezali komonana mingi, oyo ekoki kosala ete ba points de connexion ezala dégager. Yango ekoki kokitisa na nzela ya bokeli ya structure (lokola kobomba ba espaces ya expansion) to na kosalelaka ba connecteurs flexibles.